Lam Research [NASDAQ: LRCX]

As electronic devices become more sophisticated, the demand for semiconductor technology that can deliver greater performance and capacity at lower cost continues to increase. These trends have fueled major advancements in semiconductor technology, with 2D NAND transitioning to 3D NAND over the last decade. The 3D transition has also begun in logic, with FinFET technology giving way to gate-all-around (GAA) transistors and complementary field-effect transistor (CFET) architecture offering attractive benefits. Many are also expecting DRAM to follow in the future. However, scaling semiconductors in the “3D era” is immensely difficult. Chipmakers contend with rising levels of complexity at every new node and are challenged to increase transistor density while reducing power consumption.

Continued advancement in fabrication methods and technologies will be essential to enable and further scale the next-generation of GAA transistors, DRAM architectures and 3D NAND devices that today contain over 200 layers. To sustainably create chips with nano scale-level precision and the right cost structure, wafer fabrication equipment (WFE) makers like Lam Research will need to push the boundaries of plasma physics, materials engineering and data science to deliver the equipment solutions needed. Harnessing the power of data is proving to be a game-changer in delivering these capabilities into production. We are collecting richer data from our equipment and using more advanced data science techniques to convert that into repeatable processing of millions of wafers.

As the industry tackles the challenges of the 3D era, here are five potential trends to watch.

Multi-function process chambers will bring etch and dep even closer together for high-volume production

As films become more complex and nuanced, and requirements increase for both vertical and lateral fill and removal, chip manufacturing processes must evolve to meet a range of requirements in economically viable ways. A promising avenue is the performance of multiple functions in a single process chamber. This could include integrating different deposition or etch techniques to handle the demands of 3D structures, or even the integration of both deposition and etch capabilities, with an eye toward better coverage of 3D topography and in-situ repair processes. This approach may accelerate reliable film creation in the most challenging high-volume situations.

More advanced logic chips will need more advanced interconnect metals

Tungsten and tungsten oxides have already begun to displace damascene copper in some logic interconnects. As scaling in the 3D era continues, wafer fabrication technologies are pushing the boundaries of traditionally used metals to achieve less resistance and minimize power consumption and signal loss. Alternative metals such as Molybdenum are also being explored, particularly for backend applications.

The integration of chiplets will enable greater scaling to extend Moore's law

Continued collaboration, innovation, and new breakthroughs that take fresh approaches and leverage abundant data may hold the keys to powering progress and more sustainable manufacturing to deliver leading-edge technology.

As silicon scaling becomes more expensive, it also becomes more challenging to hold to the traditional development time between technology nodes. Chipmakers are adopting chiplet-based solutions to enable scaling beyond silicon. Packaging plays a significant role in driving greater system-in-package integration and extending Moore’s Law. TSV etch and plating solutions will be critical in high-aspect ratio integration schemes for advanced packaging solutions. New substrate-based approaches are also necessary to meet the requirements for next-level interconnect. Lam’s recent acquisition of SEMSYSCO broadens its packaging offerings to bring innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration.

“We are collecting richer data from our equipment and using more advanced data science techniques to convert that into repeatable processing of millions of wafers.”

Data insights will drive greater operational efficiency

AI-based predictive modeling techniques are accelerating R&D and enabling chipmakers to get to the manufacturing step faster, while giving tool and process developers new insights and greater efficiency. Increasingly, data has also become a critical asset during the manufacturing process. In-chamber sensors can monitor tool consistency and help quickly detect issues. A great example is Lam’s groundbreaking, self-aware Sense.i® platform, which brings together data intelligence with advanced plasma etch capabilities in a compact, high-density architecture to deliver high-productivity process performance. Powered by Lam’s Equipment Intelligence® technology, the Sense.i platform delivers the critical etch capabilities required to continue advancing uniformity and etch profile control for maximizing yield and lowering wafer costs. Sense.i enables semiconductor manufacturers to capture and analyze data, including pattern recognition, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs and deliver machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximize wafer output.

Sustainable innovation will deliver performant chips that use fewer materials

As demonstrated by Lam’s 2021 goal of 100 percent renewable energy by 2030 and to achieve net zero by 2050 and the formation of SEMI’s Semiconductor Climate Consortium in 2022, there is increasing focus on advancing sustainability. Many chipmakers are looking for manufacturing equipment and technologies to not only deliver the right performance and cost structure but also support their long-term goals to reduce power consumption and use fewer materials.

Conclusion

The growth of sophisticated electronic devices that demand increasingly advanced semiconductor technology is challenging WFE providers and chipmakers to think beyond current methods and materials in the 3D era. Continued collaboration, innovation and new breakthroughs that take fresh approaches and leverage abundant data may hold the keys to powering progress and more sustainable manufacturing to deliver leading-edge technology.